Integrated microelectronics solutions from concept to scale.

Enhanced microelectronic capabilities.

Plexus is a proven leader in advanced microelectronics manufacturing and assembly solutions. Leveraging over 35 years of technology leadership in design and manufacturing — with proven expertise in high-complexity, high-reliability and harsh environmental products — we are uniquely positioned to design, manufacture and deliver microelectronic products that exceed our customers’ expectations.

Plexus has developed industry-leading capabilities through product and process characterization. We have a highly experienced team led by talented industry veterans and we work closely with our customers to ensure we have the capabilities and expertise to meet their needs.

Experience and Expertise

Robust set of capabilities.

Broad MicroE capabilities include:

  • Custom packaging and process development
  • Precision die attach (flip chip, epoxy and eutectic)
  • Gold and aluminum wire and ribbon bonding
  • Stud bumping
  • Precision automated underfill
  • Dam and fill encapsulation
  • Extensive in-house test, screening and inspection
Product and technology focus.

Focused on products and technologies to meet a number of MicroE needs, including:

  • Hybrids and integrated mixed technology assemblies
  • Chip and wire
  • Flip chip
  • Multi-chip modules
  • System-in-package
  • RF / microwave modules
  • Power modules
  • MEMS and 3D packaging
  • Optoelectronics / imaging devices
  • Quilt PackagingTM
Full range of services.

MicroE services include:

  • Product design
  • Process development
  • Materials evaluation
  • Prototype to production
  • Test and measurement
  • Reliability and failure analysis

Regulatory expertise and compliance. 

  • ISO 9001, ISO 13485 and ISO 14001 certified
  • AS9100 certified
  • ANSI / EDS S20.20 certified
  • IPC J-STD-001 and Space certified
  • DoD DMEA Accredited Trusted Sourcete 
  • AS5553-Compliant Counterfeit Parts Avoidance
  • Screening IAW MIL-PRF-38534
  • Testing IAW MIL-STD-883 methods
  • Robust materials obsolescence management